HBM3

Though the formal specification has yet to be ratified by JEDEC, the memory industry as a whole is already gearing up for the upcoming launch of the next generation of High Bandwidth Memory, HBM3. Following announcements earlier this summer from controller IP vendors like Synopsys and Rambus, this morning SK Hynix is announcing that it has finished development of its HBM3 memory technology – and according to the company, becoming the first memory vendor to do so. With controller IP and now the memory itself nearing or at completion, the stage is being set for formal ratification of the standard, and eventually for HBM3-equipped devices to start rolling out later in 2022. Overall, the relatively lightweight press release from SK Hynix is roughly equal parts...

Hot Chips 2021 Live Blog: New Tech (Infineon, EdgeQ, Samsung)

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday...

8 by Dr. Ian Cutress on 8/23/2021

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

9 by Anton Shilov on 2/11/2020

Samsung Starts Production of 8 Gb DDR4-3600 ICs Using 2nd Gen 10nm-Class Tech

Samsung late on Wednesday said that it had initiated mass production of DDR4 memory chips using its second generation '10 nm-class' fabrication process. The new manufacturing technology shrinks die...

24 by Anton Shilov on 12/20/2017

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