AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great

As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year...

41 by Anton Shilov on 5/1/2024

PCI-SIG Completes CopprLink Cabling Standard: PCIe 5.0 & 6.0 Get Wired

The PCI-SIG sends word over this morning that the special interest group has completed their development efforts on the group’s new PCI-Express cabling standard, CopprLink. Designed to go hand-in-hand...

8 by Ryan Smith on 5/1/2024

Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year

As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that...

4 by Anton Shilov on 5/1/2024

TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's

TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies...

6 by Anton Shilov on 4/30/2024

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth...

9 by Anton Shilov on 4/26/2024

TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have...

2 by Anton Shilov on 4/26/2024

TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...

6 by Anton Shilov on 4/25/2024

TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...

0 by Anton Shilov on 4/25/2024

Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand

Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...

11 by Anton Shilov on 4/24/2024

Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years

As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...

13 by Anton Shilov on 4/23/2024

Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND

Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...

2 by Anton Shilov on 4/23/2024

JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...

14 by Anton Shilov on 4/22/2024

SK Hynix and TSMC Team Up for HBM4 Development

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...

5 by Anton Shilov on 4/19/2024

AMD Announces Ryzen Pro 8000 and Ryzen Pro 8040 Series CPUs: Commercial Desktop Gets AI

AMD is looking to drive the AI PC market with options across multiple product lines, which aren't limited to consumer processors. While primarily designed for the commercial sector, AMD...

6 by Gavin Bonshor on 4/19/2024

TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...

11 by Anton Shilov on 4/19/2024

ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...

13 by Anton Shilov on 4/18/2024

Intel and Sandia National Labs Roll Out 1.15B Neuron “Hala Point” Neuromorphic Research System

While neuromorphic computing remains under research for the time being, efforts into the field have continued to grow over the years, as have the capabilities of the specialty chips...

5 by Ryan Smith on 4/17/2024

Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...

6 by Anton Shilov on 4/17/2024

Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...

5 by Anton Shilov on 4/16/2024

NVIDIA Intros RTX A1000 and A400: Entry-Level ProViz Cards Get Ray Tracing

With NVIDIA’s Turing architecture turning six years old this year, the company has been retiring many of the remaining Turing products from its video card lineup. And today that...

0 by Ryan Smith on 4/16/2024
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