7nm

TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are willing to pay for its services. While the company admits that demand for chips aimed at consumer devices is slowing, demand for 5G, AI, HPC, and automotive chips remains steady. In fact, TSMC's main problem at present is getting more fab equipment, as ASML and other tool firms and reporting that demand for semiconductor production tools significantly exceeds supply. Last week TSMC posted its financial results for the second quarter of 2022. The company's revenue hit a record $18.2 billion, which was a year-over-year increase of 43.5%. The company revealed that while its sales were up...

AMD: We’re Using an Optimized TSMC 5nm Process

When AMD started using TSMC’s 7nm process for the Zen 2 processor family that launched in November 2019, one of the overriding messages of that launch was that it...

44 by Dr. Ian Cutress on 1/10/2022

Hot Chips 2021 Live Blog: Graphics (Intel, AMD, Google, Xilinx)

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday...

16 by Dr. Ian Cutress on 8/24/2021

The AMD Ryzen 7 5700G, Ryzen 5 5600G, and Ryzen 3 5300G Review

Earlier this year, AMD launched its Zen 3 based desktop processor solutions with integrated graphics. Marketed as the Ryzen 5000G family, these processors are the latest offering to combine...

136 by Dr. Ian Cutress on 8/4/2021

Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated...

326 by Dr. Ian Cutress on 7/26/2021

Intel Accelerated Webcast on July 26th: Update on Process Technology and Roadmaps

Earlier this year, new Intel CEO Pat Gelsinger outlined his new ‘IDM 2.0’ vision for Intel. This vision was a three pronged strategy based on improving its own process...

32 by Dr. Ian Cutress on 7/12/2021

Intel to Create RISC-V Development Platform with SiFive P550 Cores on 7nm in 2022

As part of SiFive’s announcements today, along with enabling SiFive IP on Intel’s Foundry Service offerings, Intel will be creating its own RISC-V development platform using its 7nm process...

35 by Dr. Ian Cutress on 6/22/2021

Intel Licenses SiFive’s Portfolio for Intel Foundry Services on 7nm

Today’s announcement from SiFive comes in two parts; this part is significant as it recognizes that Intel will be enabling SiFive’s IP portfolio on its 7nm manufacturing process for...

8 by Dr. Ian Cutress on 6/22/2021

An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers...

28 by Dr. Ian Cutress on 6/8/2021

AMD Ryzen 5000G: Zen 3 APUs for Desktop Coming August 5th

Back in April of this year, AMD announced its new series of Ryzen 5000G processors with integrated graphics. These processors were an upgrade over the previous generation of 4000G...

35 by Dr. Ian Cutress on 5/31/2021

TSMC Q1 2021 Process Node Revenue: More 7nm, No More 20nm

This week TSMC has disclosed its full quarterly financial results for Q1 2021. In those results the company often explains where the revenue demand is for its technologies, and...

40 by Dr. Ian Cutress on 4/15/2021

AMD Ryzen 5000G APUs: OEM Only For Now, Full Release Later This Year

With the high demand for semiconductors causing most companies to focus on their high margin, high profitability components, I wasn’t expecting to see many launches of low-to-mid range hardware...

67 by Dr. Ian Cutress on 4/13/2021

Intel to Revive ‘Tick-Tock’ Model, Unquestioned CPU Leadership Performance in 2024/2025

As part of today’s announcements, during Intel’s Q&A session after the prepared remarks, CEO Pat Gelsinger explained how Intel is going to revive its fortunes when it comes to...

110 by Dr. Ian Cutress on 3/23/2021

Intel’s New IDM 2.0 Strategy: $20b for Two Fabs, Meteor Lake 7nm Tiles, New Foundry Services, IBM Collaboration, Return of IDF

The new CEO of Intel, Pat Gelsinger, has today outlined his vision for Intel over the coming years. During an online presentation entitled ‘Intel Unleashed: Engineering The Future’, Pat...

159 by Dr. Ian Cutress on 3/23/2021

Intel CEO Pat Gelsinger To Host Webcast About Intel’s Future On March 23rd

Intel today has announced that the company will be holding an event on March 23rd to discuss the future of engineering at the company. Dubbed “Intel Unleashed: Engineering the...

33 by Ryan Smith on 3/17/2021

Xbox Series X SoC: Power, Thermal, and Yield Tradeoffs

This week at ISSCC (International Solid State Circuits Conference), Microsoft presented a talk titled ‘Xbox Series X SoC: A Next Generation Gaming Console’, with hardware engineer Paul Paternoster presenting...

82 by Dr. Ian Cutress on 2/15/2021

AMD Reports Q4 2020 Earnings: Analyst Q&A Transcript

At the end of every financial call, invited financial analysts have an opportunity to probe the key members of the company on the numbers, as well as future products...

11 by Dr. Ian Cutress on 1/26/2021

AMD Zen 3: An AnandTech Interview with CTO Mark Papermaster

The announcement of the new Ryzen 5000 processors, built on AMD’s Zen 3 microarchitecture, has caused waves of excitement and questions as to the performance. The launch of the...

202 by Dr. Ian Cutress on 10/16/2020

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...

3 by Dr. Ian Cutress on 8/25/2020

Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking

One of the main battlegrounds of future leading-edge semiconductor products will be in the packaging technology: being able to integrate multiple elements of silicon onto the same package with...

11 by Dr. Ian Cutress on 8/21/2020

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