11LPP

Today we’re seeing a very interesting announcement from Qualcomm: The new Snapdragon 675 chipset is a direct successor to the current generation Snapdragon 670 which was only announced back in August. The Snapdragon 675 iterates on the current design, bringing some important upgrades. Qualcomm Snapdragon Upper Mid-Range SoCs SoC Snapdragon 670 Snapdragon 710 Snapdragon 675 CPU 2x Kryo 360 (CA75) @ 2.0GHz 6x Kryo 360 (CA55) @ 1.7GHz 2x Kryo 360 (CA75) @ 2.2GHz 6x Kryo 360 (CA55) @ 1.7GHz 2x Kryo 460 (CA76) @ 2.0GHz 256KB L2 6x Kryo 460 (CA55) @ 1.7GHz 64KB L2 GPU Adreno 615 Adreno 616 Adreno 612 DSP Hexagon 685 ISP/ Camera Spectra 250 ISP 25MP single / 16MP dual Spectra 250 ISP 32MP single / 20MP dual Spectra 250 ISP triple-camera support Memory 2x 16-bit @ 1866MHz LPDDR4X 14.9GB/s 1MB system cache Integrated Modem Snapdragon X12 LTE (Category 15/13) DL = 600Mbps 3x20MHz CA, 256-QAM UL = 150Mbps 2x20MHz CA, 64-QAM Snapdragon X15 LTE (Category 15/13) DL = 800Mbps 3x20MHz CA, 256-QAM UL = 150Mbps 2x20MHz...

Samsung Details 11LPP Process Technology: 10 nm BEOL Meets 14 nm Elements

Samsung has added a new manufacturing technology into its roadmap. The 11LPP fabrication process is designed for mainstream and higher-end smartphone SoCs. The technology will come online next year...

23 by Anton Shilov on 9/29/2017

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